DocumentCode
549746
Title
3D integration from the viewpoint of high-end server system design
Author
Burns, Jeffrey L.
Author_Institution
T.J. Watson Res. Center, IBM, Yorktown Heights, NY, USA
fYear
2011
fDate
14-16 June 2011
Firstpage
186
Lastpage
187
Abstract
3D integration is a promising new technology family with several characteristics that could be exploited to add value to high-performance server systems. Potential benefits include higher computational density, lower power, and increased modularity with respect to 2D implementations. However, 3D affects design in fundamental ways. This paper describes how 3D affects design and architecture, and explains why a multi-disciplinary, co-design approach is needed to realize the full benefits of 3D for high-performance applications.
Keywords
queueing theory; three-dimensional integrated circuits; 3D integration; high-end server system design; high-performance server systems; multidisciplinary codesign approach; Chip scale packaging; Computer architecture; Integrated circuit interconnections; Microprocessors; Servers; Silicon; Three dimensional displays; 3D; 3D architecture; 3D design; 3DI;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology (VLSIT), 2011 Symposium on
Conference_Location
Honolulu, HI
ISSN
0743-1562
Print_ISBN
978-1-4244-9949-6
Type
conf
Filename
5984698
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