• DocumentCode
    549746
  • Title

    3D integration from the viewpoint of high-end server system design

  • Author

    Burns, Jeffrey L.

  • Author_Institution
    T.J. Watson Res. Center, IBM, Yorktown Heights, NY, USA
  • fYear
    2011
  • fDate
    14-16 June 2011
  • Firstpage
    186
  • Lastpage
    187
  • Abstract
    3D integration is a promising new technology family with several characteristics that could be exploited to add value to high-performance server systems. Potential benefits include higher computational density, lower power, and increased modularity with respect to 2D implementations. However, 3D affects design in fundamental ways. This paper describes how 3D affects design and architecture, and explains why a multi-disciplinary, co-design approach is needed to realize the full benefits of 3D for high-performance applications.
  • Keywords
    queueing theory; three-dimensional integrated circuits; 3D integration; high-end server system design; high-performance server systems; multidisciplinary codesign approach; Chip scale packaging; Computer architecture; Integrated circuit interconnections; Microprocessors; Servers; Silicon; Three dimensional displays; 3D; 3D architecture; 3D design; 3DI;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology (VLSIT), 2011 Symposium on
  • Conference_Location
    Honolulu, HI
  • ISSN
    0743-1562
  • Print_ISBN
    978-1-4244-9949-6
  • Type

    conf

  • Filename
    5984698