Development of a high speed die bonding system

Die bonding is a very important process of semiconductor packaging. The quality of the die bonding depends on the speed, accuracy, and precision of the pick and place movement. As the performance of Taiwan´s semiconductor packaging equipments still can not compete with foreign products, the goal of this research is to cooperate with a company to develop a better machine to increase the production speed and precision. To verify the design, the research has built a prototype. The test results show that the system can reach a maximum speed of 11000UPH, and its positioning precision and repeatability are less than 50μm@3σ.