DocumentCode
55130
Title
Atomistic Pseudo-Transient BTI Simulation With Inherent Workload Memory
Author
Rodopoulos, Dimitrios ; Weckx, Pieter ; Noltsis, Michail ; Catthoor, Francky ; Soudris, Dimitrios
Author_Institution
MicroLab, Nat. Tech. Univ. of Athens, Athens, Greece
Volume
14
Issue
2
fYear
2014
fDate
Jun-14
Firstpage
704
Lastpage
714
Abstract
Bias Temperature Instability (BTI) is a major concern for the reliability of decameter to nanometer devices. Older modeling approaches fail to capture time-dependent device variability or maintain a crude view of the device´s stress. Previously, a two-state atomistic model has been introduced, which is based on gate stack defect kinetics. Its complexity has been preventing seamless integration in simulations of large device inventories over typical system lifetimes. In this paper, we present an approach that alleviates this complexity. We introduce a novel signal representation for the gate stress. Using this format, atomistic BTI simulations require less model iterations while exhibiting minimum accuracy degradation. We also enable full temperature and voltage supply dependency since these attributes are far from constant in modern integrated systems. The proposed simulation methodology retains both the atomistic property and the workload memory that remain major differentiators of defect-based BTI simulation, in comparison to state-of-the-art approaches.
Keywords
nanoelectronics; negative bias temperature instability; semiconductor device models; semiconductor device reliability; atomistic pseudotransient BTI simulation; bias temperature instability; decameter device reliability; defect-based BTI simulation; device stress; differentiators; gate stack defect kinetics; gate stress; inherent workload memory; integrated systems; nanometer device reliability; signal representation; system lifetimes; time-dependent device variability; two-state atomistic model; voltage supply dependency; Accuracy; Computational modeling; Equations; Integrated circuit modeling; Logic gates; Mathematical model; SPICE; Analytical models; circuit simulation; digital circuit simulation; semiconductor device reliability;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2014.2314356
Filename
6780572
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