• DocumentCode
    55130
  • Title

    Atomistic Pseudo-Transient BTI Simulation With Inherent Workload Memory

  • Author

    Rodopoulos, Dimitrios ; Weckx, Pieter ; Noltsis, Michail ; Catthoor, Francky ; Soudris, Dimitrios

  • Author_Institution
    MicroLab, Nat. Tech. Univ. of Athens, Athens, Greece
  • Volume
    14
  • Issue
    2
  • fYear
    2014
  • fDate
    Jun-14
  • Firstpage
    704
  • Lastpage
    714
  • Abstract
    Bias Temperature Instability (BTI) is a major concern for the reliability of decameter to nanometer devices. Older modeling approaches fail to capture time-dependent device variability or maintain a crude view of the device´s stress. Previously, a two-state atomistic model has been introduced, which is based on gate stack defect kinetics. Its complexity has been preventing seamless integration in simulations of large device inventories over typical system lifetimes. In this paper, we present an approach that alleviates this complexity. We introduce a novel signal representation for the gate stress. Using this format, atomistic BTI simulations require less model iterations while exhibiting minimum accuracy degradation. We also enable full temperature and voltage supply dependency since these attributes are far from constant in modern integrated systems. The proposed simulation methodology retains both the atomistic property and the workload memory that remain major differentiators of defect-based BTI simulation, in comparison to state-of-the-art approaches.
  • Keywords
    nanoelectronics; negative bias temperature instability; semiconductor device models; semiconductor device reliability; atomistic pseudotransient BTI simulation; bias temperature instability; decameter device reliability; defect-based BTI simulation; device stress; differentiators; gate stack defect kinetics; gate stress; inherent workload memory; integrated systems; nanometer device reliability; signal representation; system lifetimes; time-dependent device variability; two-state atomistic model; voltage supply dependency; Accuracy; Computational modeling; Equations; Integrated circuit modeling; Logic gates; Mathematical model; SPICE; Analytical models; circuit simulation; digital circuit simulation; semiconductor device reliability;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2014.2314356
  • Filename
    6780572