• DocumentCode
    552339
  • Title

    Physics-based modeling of nonplanar nanodevices (FinFETs) and their response to radiation

  • Author

    Turowski, Marek ; Raman, Ashok ; Xiong, Weize

  • Author_Institution
    CFD Res. Corp. (CFDRC), Huntsville, AL, USA
  • fYear
    2011
  • fDate
    16-18 June 2011
  • Firstpage
    460
  • Lastpage
    465
  • Abstract
    The paper presents details of our physics-based three-dimensional (3D) device modeling coupled in mixed-mode with external load circuit and parasitics, which enabled accurate simulation of single-event effects (SEEs) in nonplanar nano-scale devices, such as MultiGate Field Effect Transistors (MuGFETs) or FinFETs. We show the importance of correct device physics models, including mobility in different crystal planes of strained silicon, as well as effects of parasitics and load circuit modeling, for correct computation of both steady-state and transient characteristics of FinFETs. Mixed-mode coupling of a realistic load circuit, including experimental parasitics, with the 3D TCAD device model, is critical to be able to compute single-event transient current waveforms and charge collection characteristics that reflect well experimental results.
  • Keywords
    MOSFET; elemental semiconductors; semiconductor device models; silicon; technology CAD (electronics); 3D TCAD device; FinFET; MuGFET; Si; external load circuit; mixed-mode coupling; multigate field effect transistors; nonplanar nanodevices; parasitics; physics-based modeling; radiation response; single-event effects; single-event transient current waveforms; strained silicon; three-dimensional device modeling; Computational modeling; FinFETs; Integrated circuit modeling; Logic gates; Silicon; Solid modeling; Three dimensional displays; 3D; FinFET; MuGFET; MultiGate Field Effect Transistors; Non-planar CMOS; Silicon-on-Insulator (SOI); TCAD; integrated circuits (ICs); mixed-mode simulation; radiation effects; single-event effects (SEE); single-event upset (SEU);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mixed Design of Integrated Circuits and Systems (MIXDES), 2011 Proceedings of the 18th International Conference
  • Conference_Location
    Gliwice
  • Print_ISBN
    978-1-4577-0304-1
  • Type

    conf

  • Filename
    6015959