Study of thermal interfaces aging for power electronics applications

Author

Ousten, J.-P. ; Khatir, Z.

Author_Institution

Lab. of New Technol., IFSTTAR, Versailles, France

fYear

2011

fDate

Aug. 30 2011-Sept. 1 2011

Firstpage

1

Lastpage

10

Abstract

This paper presents new investigations on the aging of Thermal Interface Materials (TIM) subjected to thermal cycling conditions. The challenge was to design a specific and original set-up in order to not only undergo avionic temperature mission profile (-50°C/+150°C) but also to perform standardized thermal characterization at always same conditions. Thermal conductivity is used as aging indicator. Several TIM materials (change phase, graphite and polymer based) have undergone 1500 of such cycles. As a result, only the phase change material thermal interface has been affected with a 30% increase of initial thermal resistance.

Keywords

ageing; avionics; phase change materials; power electronics; thermal conductivity; TIM; aging indicator; avionic temperature mission profile; phase change material thermal interface; power electronics application; standardized thermal characterization; temperature -50 degC; temperature 150 degC; thermal conductivity; thermal cycling condition; thermal interface aging; thermal interface material; thermal resistance; Aging; Conductivity; Heating; Materials; Temperature measurement; Thermal conductivity; Thermal resistance; Material interface degradation; Static thermal characterization; Thermal Interface Material; Thermal aging; Thermal conductivity; Transient thermal analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics and Applications (EPE 2011), Proceedings of the 2011-14th European Conference on

Conference_Location

Birmingham

Print_ISBN

978-1-61284-167-0

Electronic_ISBN

978-90-75815-15-3

Type

conf

Filename

6020125