Title :
Impact of solder fatigue on module lifetime in power cycling tests
Author :
Scheuermann, Uwe ; Schmidt, R.
Author_Institution :
SEMIKRON Elektron. GmbH & Co. KG, Nürnberg, Germany
fDate :
Aug. 30 2011-Sept. 1 2011
Abstract :
Different end-of-life mechanisms in power modules (i.e., solder fatigue and wire bond failures) and their interactions are subject of investigation. Their contribution to the lifetime limit is especially relevant for the extrapolation of accelerated endurance test results to application conditions. The comparison of Ag-diffusion sintered modules with traditional soldered modules allows investigating the influence of solder fatigue on the lifetime of power modules under active power cycling.
Keywords :
fatigue testing; materials testing; solders; Ag; accelerated endurance test extrapolation; active power cycling; diffusion sintered modules; end-of-life mechanisms; power cycling tests; power modules lifetime; solder fatigue; wire bond failures; Fatigue; Junctions; Multichip modules; Reliability; Stress; Temperature; Wires; IGBT; Power cycling; Reliability;
Conference_Titel :
Power Electronics and Applications (EPE 2011), Proceedings of the 2011-14th European Conference on
Conference_Location :
Birmingham
Print_ISBN :
978-1-61284-167-0
Electronic_ISBN :
978-90-75815-15-3
