DocumentCode :
553351
Title :
High-temperature behavior of SiC power diodes
Author :
Buttay, Cyril ; Raynaud, C. ; Morel, Herve ; Lazar, Mircea ; Civrac, G. ; Bergogne, Dominique
Author_Institution :
Lab. Ampere, Univ. de Lyon, Villeurbanne, France
fYear :
2011
fDate :
Aug. 30 2011-Sept. 1 2011
Firstpage :
1
Lastpage :
9
Abstract :
Silicon Carbide devices are in theory able to operate at very high temperatures, but many mechanisms actually lower the limit. In this paper we describe two of these mechanisms: the thermal run-away, and the ageing of the device. Ageing effects are assessed through two different set-ups: SiC diodes in plastic packages are stored for long periods (up to 2000 hrs) in a furnace with a temperature ranging from 200 to 250°C, while bare die diodes are stored in vacuum at a temperature of 350°C. A study is then performed to assess whether the diodes under test, which have a MPS structure, are sensitive to thermal run-away. It is found that the mixed unipolar-bipolar architecture offers much more robustness than a pure Schottky Barrier Diode would.
Keywords :
ageing; high-temperature electronics; plastic packaging; power semiconductor diodes; semiconductor device packaging; silicon compounds; wide band gap semiconductors; MPS structure; Schottky barrier diode; SiC; bare die diode; device ageing effect; high-temperature behavior; mixed unipolar-bipolar architecture; plastic package; power diode; temperature 200 degC to 250 degC; temperature 350 degC; thermal runaway; Aging; Current measurement; Resistance; Schottky diodes; Silicon carbide; Temperature sensors; Device modeling; High temperature electronics; Reliability; Schottky diode; Silicon carbide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics and Applications (EPE 2011), Proceedings of the 2011-14th European Conference on
Conference_Location :
Birmingham
Print_ISBN :
978-1-61284-167-0
Electronic_ISBN :
978-90-75815-15-3
Type :
conf
Filename :
6020207
Link To Document :
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