• DocumentCode
    553385
  • Title

    Diffusion soldering for automotive power MOSFETs offers the first 100% lead free die attach

  • Author

    Purschel, Marco ; Roschlau, K.

  • Author_Institution
    Infineon Technol. AG, Neubiberg, Germany
  • fYear
    2011
  • fDate
    Aug. 30 2011-Sept. 1 2011
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Every year, end of life vehicles generate between 8 and 9 million tons of waste. In the paper the first automotive released lead free power MOSFET with diffusion soldering die attach in a TO package will be introduced.
  • Keywords
    automotive electronics; microassembling; power MOSFET; soldering; automotive power MOSFETs; diffusion soldering; lead free die attach; Environmentally friendly manufacturing techniques; Lead; MOSFETs; Materials; Microassembly; Resistance; Soldering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and Applications (EPE 2011), Proceedings of the 2011-14th European Conference on
  • Conference_Location
    Birmingham
  • Print_ISBN
    978-1-61284-167-0
  • Electronic_ISBN
    978-90-75815-15-3
  • Type

    conf

  • Filename
    6020242
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=553385