Title :
Crack-healing behavior of Al2O3/SiC composite
Author :
Yingkui Guo ; Rui Chen ; Xiulan He ; Junjie Qi ; Dayong Li
Author_Institution :
Sch. of Mater. Sci. & Eng., Harbin Univ. of Sci. & Technol., Harbin, China
Abstract :
Al2O3/SiC composite was prepared at 1700°C by the hot-press sintering method, using Al2O3 and SiC powders as the raw materials. The composite was mechanically whittled with the different thicknesses for the bending strength test. The results exhibited that the bending strength decreased as the whittled thickness increasing. The SEM observations revealed more cracks appeared on the surface of the sample as the whittled thickness increasing. Then, the sample whittled with the thicknesses of 20μm was sintered at 1200°C for certain time to have a further insight into the effect of the sintering time on the microstructure and mechanical property in this study. It could be found that, after sintered at 1200°C for 60min, the maximum of the bending strength for Al2O3/SiC composite was obtained, reaching 343.88MPa. XRD and SEM results suggested that the crack-healing mechanism of Al2O3/SiC composite was mainly due to the oxidation of SiC when the composite was sintered in air. The oxidation reaction could be described as follows: SiC+2O2→SiO2+CO2 (CO). The generated SiO2 filled up the cracks, which made the cracks healed and the strength restored.
Keywords :
X-ray diffraction; alumina; bending strength; composite materials; crystal microstructure; hot pressing; oxidation; powders; scanning electron microscopy; silicon compounds; sintering; surface cracks; wide band gap semiconductors; Al2O3-SiC; SEM; XRD; bending strength test; composite material; crack-healing mechanism; hot-press sintering; microstructure; oxidation reaction; powders; temperature 1200 degC; temperature 1700 degC; time 60 min; Aluminum oxide; Ceramics; Oxidation; Silicon carbide; Surface cracks; Surface treatment; System-on-a-chip; Al2O3/SiC composite; Bending strength; Crack-healing; Sintering;
Conference_Titel :
Strategic Technology (IFOST), 2011 6th International Forum on
Conference_Location :
Harbin, Heilongjiang
Print_ISBN :
978-1-4577-0398-0
DOI :
10.1109/IFOST.2011.6020975