DocumentCode :
554511
Title :
A new method for the analysis of temperature-dependent resistances and inductances of multiconductor cable
Author :
Men Xiuhua ; Ma Yuzhen ; Shao Haiyan
Author_Institution :
Sch. of Mech. Eng., Univ. of Jinan, Jinan, China
Volume :
4
fYear :
2011
fDate :
12-14 Aug. 2011
Firstpage :
1892
Lastpage :
1896
Abstract :
The whole mechanical test procession, especially transmission cable is effected evidently by environment temperature fluctuation. So of particular interest in the paper is to discuss the resistance and inductance parameters of multiconductor at environment of changing temperature. A new approach with the given formulas is presented to calculate electric parameters using finite element method. And then, the temperature-dependent characteristics of resistance and inductance are obtained, which are agreed with the result obtained by energy method. The change of equivalent current density for multiconductor also highlights the parameters change when proximate effect is considered. The result is shown that the temperature-dependent parameters bring more important responses on the terminal of circuit network containing certain deviation. It is shown that. For the first time, results are shown for the lossy transmission cable with temperature-dependent parameters characteristic, which are used to quantify the main practical engineering.
Keywords :
current density; finite element analysis; multiconductor transmission lines; circuit network; electric parameters; environment temperature fluctuation; equivalent current density; finite element method; lossy transmission cable; multiconductor cable inductances analysis; multiconductor inductance parameters; multiconductor resistance parameters; practical engineering; temperature-dependent parameters; temperature-dependent resistances analysis; Conductors; Current density; Educational institutions; Inductance; Mathematical model; Power cables; Resistance; Mechanical test; Multiconductor; Parameters extraction; Temperature-demendent;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic and Mechanical Engineering and Information Technology (EMEIT), 2011 International Conference on
Conference_Location :
Harbin, Heilongjiang, China
Print_ISBN :
978-1-61284-087-1
Type :
conf
DOI :
10.1109/EMEIT.2011.6023408
Filename :
6023408
Link To Document :
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