DocumentCode
554670
Title
Reliability evaluation of FPC under bending stress
Author
Zhimin Liu
Author_Institution
Sch. of Mech., Electron. & Ind. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Volume
6
fYear
2011
fDate
12-14 Aug. 2011
Firstpage
2955
Lastpage
2958
Abstract
In this paper, finite element analysis method is applied for modeling and simulation of FPC to analyze its mechanical performance under the constant stress. In the simulation process, the bending method used in this research is to fix the middle of the FPC and to impose load on both sides. The results of Von Mises stress distribution between the layers of FPC are presented and analyzed with the knowledge of material mechanics. In addition, the length and the thickness of layers of FPC are taken as optimization variables. With the variables change, there are many different cases. This paper presents the stress comparison with different lengths and thickness of layers of FPC model. The simulation results show that there are different stresses between the layers of FPC model. The disbonding failure may occur between the layers of FPC under high-cycle load and the stress between layers will be reduced by changing the length of model. With ANSYS, the fatigue life of FPC is calculated approximately. The analysis result may provide some help on FPC design and manufacturing.
Keywords
bending; failure (mechanical); fatigue; finite element analysis; optimisation; printed circuit manufacture; reliability; stress analysis; ANSYS; FPC design; FPC manufacturing; FPC model; Von Mises stress distribution; bending stress; constant stress; disbonding failure; fatigue life; finite element analysis method; flexible printed circuit; high-cycle load; material mechanics; mechanical performance; reliability evaluation; Copper; Fatigue; Finite element methods; Load modeling; Reliability; Stress; Substrates; FPC; finite element analysis; mechanical performance; von mises stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic and Mechanical Engineering and Information Technology (EMEIT), 2011 International Conference on
Conference_Location
Harbin, Heilongjiang, China
Print_ISBN
978-1-61284-087-1
Type
conf
DOI
10.1109/EMEIT.2011.6023667
Filename
6023667
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