• DocumentCode
    554716
  • Title

    Study on grinding deformation of Al2O3-TiC slender bar

  • Author

    Wei Xiong ; Zhongren Wang

  • Author_Institution
    Sch. of Mech. & Automotive Eng., Xiangfan Univ., Xiangfan, China
  • Volume
    6
  • fYear
    2011
  • fDate
    12-14 Aug. 2011
  • Firstpage
    3116
  • Lastpage
    3119
  • Abstract
    The deformation of brittle and hard material slender bar has great significance in contour grinding process. In this paper, the grinding deformation for Al2O3-TiC slender bar was studied. Diamond lapping film and adhesive mounting method were applied in the experiments. The influences of grinding pressure, grinding speed and stress on deformation were discussed in detail based on the theoretical analysis and the measurement of straightness in different conditions. The bend deformation goes up with the increase of grinding pressure and speed. The internal stress will bring large deformation after grinding. Releasing the stress will improve the deformation. Experiments shown that releasing the stress two-thirds at a proper condition before final grinding can achieve the deformation below 1000 nm. Employing lapping film and adhesive mounting method in optimal condition, the Al2O3-TiC slender bar deformation in grinding can be controlled.
  • Keywords
    alumina; bars; bending; brittleness; grinding; lapping (machining); spatial variables measurement; stress analysis; titanium compounds; Al2O3-TiC; adhesive mounting method; bend deformation; brittle material; diamond lapping film; grinding; grinding deformation; grinding pressure; hard material; slender bar; straightness measurement; Deformable models; Heating; Lapping; Load modeling; Strain; Stress; Temperature measurement; deformation; grinding; slender bar; stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic and Mechanical Engineering and Information Technology (EMEIT), 2011 International Conference on
  • Conference_Location
    Harbin, Heilongjiang, China
  • Print_ISBN
    978-1-61284-087-1
  • Type

    conf

  • DOI
    10.1109/EMEIT.2011.6023747
  • Filename
    6023747