• DocumentCode
    556115
  • Title

    Analysis of radiated emissions from flexray automotive bus systems

  • Author

    Jia, Jin ; Frei, Stephan

  • Author_Institution
    Tech. Univ. Dortmund, Dortmund, Germany
  • fYear
    2011
  • fDate
    26-30 Sept. 2011
  • Firstpage
    234
  • Lastpage
    239
  • Abstract
    Due to the high data rates of FlexRay communication systems, EMC can be a big challenge. It is crucial to develop new and fast methodologies to evaluate electromagnetic disturbances. This paper focuses on the radiated emissions from FlexRay communication systems, which is mainly induced by common mode current on the twisted-pair cable. VHDL-AMS modeling language is employed to investigate common mode currents in FlexRay bus networks. An equivalent common mode radiation model of a twisted-pair cable above a reference ground plane is established by simplifying it into a single transmission line parallel to ground. Through combing common mode currents as radiation source by VHDL-AMS analysis with a simplified radiation model, efficient analysis of radiated emissions from bus networks is possible. The proposed fast approaches are an analytic method and a multiple-dipole method based on Green function and mirror theory. The radiated emissions from different topologies of automotive networks are analyzed and verified by full wave methods.
  • Keywords
    Green´s function methods; electromagnetic compatibility; hardware description languages; simulation languages; system buses; telecommunication network topology; telecommunication transmission lines; twisted pair cables; EMC; FlexRay automotive bus system; FlexRay bus network; FlexRay communication system; Green function; VHDL-AMS modeling language; analytic method; automotive network; common mode current; common mode radiation model; data rate; full wave method; ground plane; mirror theory; multiple dipole method; radiated emission; radiated emission analysis; radiation model; radiation source; transmission line; twisted pair cable; Electric fields; Electromagnetic compatibility; Impedance; Insulation; Topology; Transceivers; Wires; CAN; EMC; FlexRay; VHDL-AMS; automotive bus systems; common mode current; radiated emission;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    EMC Europe 2011 York
  • Conference_Location
    York
  • Print_ISBN
    978-1-4577-1709-3
  • Type

    conf

  • Filename
    6078635