Title :
System-level thermal-aware design of 3D multiprocessors with inter-tier liquid cooling
Author :
Sridhar, Arvind ; Sabry, Mohamed M. ; Atienza, David
Author_Institution :
Embedded Syst. Lab. (ESL), Ecole Polytech. Fed. de Lausanne (EPFL), Lausanne, Switzerland
Abstract :
Rising chip temperatures and aggravated thermal reliability issues have characterized the emergence of 3D multiprocessor system-on-chips (3D-MPSoCs), necessitating the development of advanced cooling technologies. Microchannel based inter-tier liquid cooling of ICs has been envisaged as the most promising solution to this problem. A system-level thermal-aware design of electronic systems becomes imperative with the advent of these new cooling technologies, in order to preserve the reliable functioning of these ICs and effective management of the rising energy budgets of high-performance computing systems. This paper reviews the recent advances in the area of system-level thermal modeling and management techniques for 3D multiprocessors with advanced liquid cooling. These concepts are combined to present a vision of a green data-center of the future which reduces the CO2 emissions by reusing the heat it generates.
Keywords :
cooling; embedded systems; heat sinks; integrated circuit reliability; integrated circuits; system-on-chip; thermal management (packaging); 3D multiprocessor system-on-chips; 3D-MPSoC; ICs; electronic systems; green data-center; high-performance computing systems; intertier liquid cooling; management techniques; system-level thermal-aware design; Heat sinks; Heat transfer; Integrated circuit modeling; Microchannel; Thermal analysis; Three dimensional displays; 3D Integration; Green Data-Centers; Liquid Cooling; System-Level Thermal Aware Design;
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2011 17th International Workshop on
Conference_Location :
Paris
Print_ISBN :
978-1-4577-0778-0
