Thermo-mechanical deformation measurement of microwave high power amplifier

A majority of total failure in microelectronic packaging is due to the fatigue failure of solder joints related to the thermo mechanical damage mechanisms during the component operation life. This work, carried out in AUDACE project shows that we can accurately measure dynamic package and die deformation resulting from thermal stress with these tools. Future work will be devoted to thermo-mechanical simulation and design optimization. The rational approach for predicting the fatigue life and the reliability of microelectronic packaging should consider all kinds of uncertainties. The structural reliability theory provides an appropriate approach to take account for uncertainties. We will propose a numerical investigation of the use of probabilistic methods in predicting the fatigue lifetime of solder joints of microelectronic packaging. This will be done with a new method of Reliability Based design Optimisation (RBDO). This will aim at revealing the effect of the uncertainties on the lifetime of microelectronic assemblies, where the variability in the material parameters (such as Young´s modulus and coefficient of thermal expansion) and in the thermal loading may have a strong effect on the lifetime prediction and the design of structures.