DocumentCode
556374
Title
In-situ analysis of thermal properties of polymer composites by embedded LED temperature sensor
Author
Yu, J.H. ; Chestakov, Dmitri ; Eggink, Erik
Author_Institution
Philips Res., Eindhoven, Netherlands
fYear
2011
fDate
27-29 Sept. 2011
Firstpage
1
Lastpage
4
Abstract
Real time and accurate measurement of thermal conductivity of polymer composites with thermal conductive fillers challenges researchers in the industrial application. Here we present an in-situ measurement method by embedding a LED or diode as a temperature sensor into the filled polymer and using the well-established T3Ster transient method to determine the temperature response of the sensor in polymer. Numerical model fitting is applied to estimate the thermal conductivity of the polymer composites with different filler/polymer ratios. Moreover we analyze the surface thermal properties of the polymer composite in near and far infrared with a range of 2.5μm-20μm. These findings are compared with other test methods such as the laser flash method and the Modular Differential Scanning Calorimeter (MDSC).
Keywords
calorimeters; filled polymers; light emitting diodes; numerical analysis; temperature sensors; thermal conductivity measurement; transient analysis; MDSC; embedded LED temperature sensor; filled polymer; in-situ measurement method; laser flash method; modular differential scanning calorimeter; numerical model fitting; polymer composites; size 2.5 mum to 20 mum; thermal conductive fillers; thermal conductivity estimation; thermal conductivity measurement; thermal property in-situ analysis; well-established T3Ster transient method; Conductivity; Heating; Light emitting diodes; Polymers; Temperature measurement; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigations of ICs and Systems (THERMINIC), 2011 17th International Workshop on
Conference_Location
Paris
Print_ISBN
978-1-4577-0778-0
Type
conf
Filename
6081024
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