• DocumentCode
    556374
  • Title

    In-situ analysis of thermal properties of polymer composites by embedded LED temperature sensor

  • Author

    Yu, J.H. ; Chestakov, Dmitri ; Eggink, Erik

  • Author_Institution
    Philips Res., Eindhoven, Netherlands
  • fYear
    2011
  • fDate
    27-29 Sept. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Real time and accurate measurement of thermal conductivity of polymer composites with thermal conductive fillers challenges researchers in the industrial application. Here we present an in-situ measurement method by embedding a LED or diode as a temperature sensor into the filled polymer and using the well-established T3Ster transient method to determine the temperature response of the sensor in polymer. Numerical model fitting is applied to estimate the thermal conductivity of the polymer composites with different filler/polymer ratios. Moreover we analyze the surface thermal properties of the polymer composite in near and far infrared with a range of 2.5μm-20μm. These findings are compared with other test methods such as the laser flash method and the Modular Differential Scanning Calorimeter (MDSC).
  • Keywords
    calorimeters; filled polymers; light emitting diodes; numerical analysis; temperature sensors; thermal conductivity measurement; transient analysis; MDSC; embedded LED temperature sensor; filled polymer; in-situ measurement method; laser flash method; modular differential scanning calorimeter; numerical model fitting; polymer composites; size 2.5 mum to 20 mum; thermal conductive fillers; thermal conductivity estimation; thermal conductivity measurement; thermal property in-situ analysis; well-established T3Ster transient method; Conductivity; Heating; Light emitting diodes; Polymers; Temperature measurement; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems (THERMINIC), 2011 17th International Workshop on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4577-0778-0
  • Type

    conf

  • Filename
    6081024