• DocumentCode
    556461
  • Title

    Distributed thermal management for embedded heterogeneous MPSoCs with dedicated hardware accelerators

  • Author

    Wu, Yen-Kuan ; Sharifi, Shervin ; Rosing, Tajana Simunic

  • Author_Institution
    Electr. & Comput. Eng. Dept., Univ. of California at San Diego, La Jolla, CA, USA
  • fYear
    2011
  • fDate
    9-12 Oct. 2011
  • Firstpage
    183
  • Lastpage
    189
  • Abstract
    This paper addresses thermal management in heterogeneous MPSoCs where the power states of the general purpose cores can be controlled by the operating system (OS) while OS is not able to control power states of the dedicated hardware accelerators (DHAs). We propose a scalable and cooperative distributed thermal management technique1 which works based on the cooperation of local controllers deployed in some of the cores. Through low overhead message passing, these controllers communicate in order to exchange temperature and performance related information which is used to find the best thermally safe set of frequency settings for the cores. Experimental results show that for our technique can successfully reduce the deadline miss rate by 47.16% in average compared to localized thermal management techniques while successfully satisfying temperature constraints.
  • Keywords
    multiprocessing systems; system-on-chip; thermal management (packaging); DHA; cooperative distributed thermal management; dedicated hardware accelerator; embedded heterogeneous MPSoC; low overhead message passing; scalable distributed thermal management; temperature constraint; Equations; Hardware; Mathematical model; Operating systems; Switches; Temperature control; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design (ICCD), 2011 IEEE 29th International Conference on
  • Conference_Location
    Amherst, MA
  • ISSN
    1063-6404
  • Print_ISBN
    978-1-4577-1953-0
  • Type

    conf

  • DOI
    10.1109/ICCD.2011.6081395
  • Filename
    6081395