DocumentCode
556461
Title
Distributed thermal management for embedded heterogeneous MPSoCs with dedicated hardware accelerators
Author
Wu, Yen-Kuan ; Sharifi, Shervin ; Rosing, Tajana Simunic
Author_Institution
Electr. & Comput. Eng. Dept., Univ. of California at San Diego, La Jolla, CA, USA
fYear
2011
fDate
9-12 Oct. 2011
Firstpage
183
Lastpage
189
Abstract
This paper addresses thermal management in heterogeneous MPSoCs where the power states of the general purpose cores can be controlled by the operating system (OS) while OS is not able to control power states of the dedicated hardware accelerators (DHAs). We propose a scalable and cooperative distributed thermal management technique1 which works based on the cooperation of local controllers deployed in some of the cores. Through low overhead message passing, these controllers communicate in order to exchange temperature and performance related information which is used to find the best thermally safe set of frequency settings for the cores. Experimental results show that for our technique can successfully reduce the deadline miss rate by 47.16% in average compared to localized thermal management techniques while successfully satisfying temperature constraints.
Keywords
multiprocessing systems; system-on-chip; thermal management (packaging); DHA; cooperative distributed thermal management; dedicated hardware accelerator; embedded heterogeneous MPSoC; low overhead message passing; scalable distributed thermal management; temperature constraint; Equations; Hardware; Mathematical model; Operating systems; Switches; Temperature control; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design (ICCD), 2011 IEEE 29th International Conference on
Conference_Location
Amherst, MA
ISSN
1063-6404
Print_ISBN
978-1-4577-1953-0
Type
conf
DOI
10.1109/ICCD.2011.6081395
Filename
6081395
Link To Document