Title :
Reduction of nuisance rate in inspection using review/inspector cycle optimization methodology
Author :
Chen, Chimin ; Chuang, Yen ; Hung, Che-Lun ; Luoh, Tuung ; Yang, Ling-Wu ; Yang, Tahone ; Chen, Kuang-Chao ; Lu, Chih-Yuan
Abstract :
Presents a collection of slides covering the following topics: inspection; review inspector cycle optimization methodology; PL3 HardMask etch nuisance rate reduction; STI etch nuisance rate reduction and process development.
Keywords :
inspection; optimisation; process design; semiconductor device manufacture; PL3 HardMask etch nuisance rate reduction; STI etch nuisance rate reduction; inspection; process development; review inspector cycle optimization methodology; Facsimile; Image color analysis; Image resolution; Inspection; Joints; Optimization; Time to market;
Conference_Titel :
Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4577-1647-8
