DocumentCode :
556815
Title :
Optimization and monitoring of bevel removal process
Author :
Chen, Yi-Chin ; Hsu, Hui-Ying ; Hung, Che-Lun ; Luoh, Tuung ; Yang, Ling-Wu ; Yang, Tahone ; Chen, Kuang-Chao ; Lu, Chih-Yuan
fYear :
2011
fDate :
5-6 Sept. 2011
Firstpage :
1
Lastpage :
15
Abstract :
A collection of slides about wafer edge inspection, tri-layer coating monitoring inspection, photoresist coating with different wafer suppliers and bevel etching removal process inspection is presented.
Keywords :
coatings; etching; inspection; photoresists; bevel etching removal process inspection; bevel removal process; photoresist coating; tri-layer coating monitoring inspection; wafer edge inspection; wafer suppliers; Coatings; Facsimile; Inspection; Lithography; Monitoring; Optimization; Resists;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
Conference_Location :
Hsinchu
ISSN :
1523-553X
Print_ISBN :
978-1-4577-1647-8
Type :
conf
Filename :
6086042
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=556815
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