• DocumentCode
    556815
  • Title

    Optimization and monitoring of bevel removal process

  • Author

    Chen, Yi-Chin ; Hsu, Hui-Ying ; Hung, Che-Lun ; Luoh, Tuung ; Yang, Ling-Wu ; Yang, Tahone ; Chen, Kuang-Chao ; Lu, Chih-Yuan

  • fYear
    2011
  • fDate
    5-6 Sept. 2011
  • Firstpage
    1
  • Lastpage
    15
  • Abstract
    A collection of slides about wafer edge inspection, tri-layer coating monitoring inspection, photoresist coating with different wafer suppliers and bevel etching removal process inspection is presented.
  • Keywords
    coatings; etching; inspection; photoresists; bevel etching removal process inspection; bevel removal process; photoresist coating; tri-layer coating monitoring inspection; wafer edge inspection; wafer suppliers; Coatings; Facsimile; Inspection; Lithography; Monitoring; Optimization; Resists;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
  • Conference_Location
    Hsinchu
  • ISSN
    1523-553X
  • Print_ISBN
    978-1-4577-1647-8
  • Type

    conf

  • Filename
    6086042