• DocumentCode
    556818
  • Title

    A 3-D super computer architecture

  • Author

    Cheng, Karl

  • fYear
    2011
  • fDate
    5-6 Sept. 2011
  • Firstpage
    1
  • Lastpage
    31
  • Abstract
    3D-IC will be the ultimate architecture of the IC design. When it leads to the 3D-Computer, no PCB no package no cable and even no connector are needed. It also has the benefit of small size light weight high speed and less power consumption to meet the global warming regulation. With the 3 dimensional IC circuit design concept a 3-D super computer can be designed with its data signal and instructions processing power millions time faster than the present computer we know of.
  • Keywords
    computer architecture; integrated circuit design; mainframes; parallel machines; power aware computing; three-dimensional integrated circuits; 3D super computer architecture; 3D-IC design; data signal; global warming regulation; instruction processing power; less power consumption; Circuit synthesis; Computer architecture; Computers; Electronic mail; Global warming; Integrated circuits; Power demand;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
  • Conference_Location
    Hsinchu
  • ISSN
    1523-553X
  • Print_ISBN
    978-1-4577-1647-8
  • Type

    conf

  • Filename
    6086045
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=556818