Title :
Vertical re-startup of plasma etching tool from earthquake
Author :
Moriya, T. ; Matsui, H. ; Kaiga, Y. ; Tanaka, Y. ; Miyauchi, K. ; Hanawa, T. ; Fukaya, K. ; Suzuki, Y. ; Ando, T.
Abstract :
Presents a collection of slides covering the following topics: background and purpose; impedance before/after quake; RF reflection fault; surface particles in chamber; particle visualization by UV light; ISPM results before/after quake; analyzing ISPM characteristics; result of defect recovery; and conclusion.
Keywords :
earthquakes; electric impedance; plasma devices; plasma diagnostics; power system faults; sputter etching; ISPM characteristics; RF reflection fault; chamber surface particles; earthquake impedence mesurement; in-situ particle monitor; particle visualization; plasma etching tool; ultraviolet light; Collaboration; Earthquakes; Impedance; Joints; Manufacturing; Plasmas; Radio frequency;
Conference_Titel :
Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4577-1647-8
