Title :
Scratch reduction in oxide CMP process
Author_Institution :
Renesas Electronics Corporation
Abstract :
• Pulsation of diaphragm gives high stress to slurry, and that result in agglomeration of slurry abrasives. • By applying maglev centrifugal pump, scratch trend was clearly improved. • It´s important that the distribution pump doesn´t give stress to slurry.
Keywords :
Adhesives; Availability; Fluids; Joints; Pumps; Slurries;
Conference_Titel :
Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
Conference_Location :
Hsinchu, Taiwan
Print_ISBN :
978-1-4577-1647-8
