DocumentCode
556848
Title
Design and development of an innovative micro-seismic spring wafer wagon and vibration improvement
Author
Shyu, Jefferson
fYear
2011
fDate
5-6 Sept. 2011
Firstpage
1
Lastpage
10
Abstract
Wafer vibration improvement over 90%. Wafer notch shift improvement 100%. Reduce wafer pollution issue by the dust caused by the particles in the wafer POD. This design can improve wafer yield and saves costs. The prototype of micro-seismic spring wafer wagon has been applied for patent.
Keywords
springs (mechanical); vibration measurement; innovative microseismic spring wafer wagon; wafer notch shift improvement; wafer pollution; wafer vibration improvement; wafer yield; Collaboration; Floors; Joints; Springs; Temperature measurement; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
Conference_Location
Hsinchu
ISSN
1523-553X
Print_ISBN
978-1-4577-1647-8
Type
conf
Filename
6086075
Link To Document