Title :
Design and development of an innovative micro-seismic spring wafer wagon and vibration improvement
Abstract :
Wafer vibration improvement over 90%. Wafer notch shift improvement 100%. Reduce wafer pollution issue by the dust caused by the particles in the wafer POD. This design can improve wafer yield and saves costs. The prototype of micro-seismic spring wafer wagon has been applied for patent.
Keywords :
springs (mechanical); vibration measurement; innovative microseismic spring wafer wagon; wafer notch shift improvement; wafer pollution; wafer vibration improvement; wafer yield; Collaboration; Floors; Joints; Springs; Temperature measurement; Vibrations;
Conference_Titel :
Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4577-1647-8
