DocumentCode
556855
Title
Components of variance for photo StS & WiS analysis
Author
Wei, Jui-Chen ; Liu, Pi-Ting
fYear
2011
fDate
5-6 Sept. 2011
Firstpage
1
Lastpage
12
Abstract
By baseline define & variance test of process variance that can show to engineer whether the process is stable or not. Furthermore the root cause can be found more quickly. Photo can\´t find out the issue point directly and monitor shot performance efficiently by "LtL, WtW, WiW (Lot to Lot,Wafer to Wafer & Within Wafer)" analysis. Base on WiW to develop "StS WiS (Shot to Shot Within Shot)" analysis, it\´s useful at checking shot health.
Keywords
computerised monitoring; wafer level packaging; WiW analysis; photo StS analysis; photo WiS analysis; process variance test; shot performance monitoring; shot to shot within shot; wafer to wafer; within wafer; Buildings; Monitoring; Planning; Semiconductor device modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
Conference_Location
Hsinchu
ISSN
1523-553X
Print_ISBN
978-1-4577-1647-8
Type
conf
Filename
6086082
Link To Document