DocumentCode
557330
Title
SiO2 -metal cantilever structures under thermal and intrinsic stress
Author
Tibeica, C. ; Damian, V. ; Muller, R.
Author_Institution
Nat. Inst. for R&D in Microtechnologies, IMT-Bucharest, Bucharest, Romania
Volume
1
fYear
2011
fDate
17-19 Oct. 2011
Firstpage
167
Lastpage
170
Abstract
The mechanical behavior of multi-layered cantilever structures made of SiO2 coated with thin metal films (chromium and gold) is investigated considering the intrinsic and thermal stress. Experimental measurements and numerical simulations were performed to analyze the influence of residual stress components on such cantilever structures.
Keywords
Young´s modulus; cantilevers; chromium; gold; internal stresses; metal-insulator boundaries; metallic thin films; multilayers; numerical analysis; silicon compounds; thermal stresses; SiO2-Au; SiO2-Cr; intrinsic stress; mechanical properties; multilayered cantilever structure; numerical simulation; residual stress component; thermal stress; thin metal films; Data models; Materials; Residual stresses; Temperature; Temperature measurement; Thermal stresses; FEM simulation; WLI characterization; cantilever; intrinsic stress; silicon oxide; thermal stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference (CAS), 2011 International
Conference_Location
Sinaia
ISSN
1545-827X
Print_ISBN
978-1-61284-173-1
Type
conf
DOI
10.1109/SMICND.2011.6095747
Filename
6095747
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