Integrated antennas in eWLB packages for 77 GHz and 79 GHz automotive radar sensors

The feasibility of an antenna-in-package (AiP) concept is demonstrated for automotive radar sensors at the 77 GHz-band. Infineon´s embedded wafer level ball grid array (eWLB) is employed as packaging technology. We developed a printed dipole antenna (PDA) and a printed loop antenna (PLA) in 8×8 mm² eWLB packages that include 3×3 mm² dummy Si chips. The fabricated eWLB packages are soldered onto evaluation boards that are designed and fabricated on an RF substrate. The measurements and the simulations are in a good agreement and predict a promising solution for the realization of cost efficient antenna-in-package concepts.