• DocumentCode
    559579
  • Title

    Application of wireless sensor nodes to commercial power consumption monitoring

  • Author

    Itoh, Toshihiro ; Fujimoto, Jun ; Maeda, Ryutaro

  • Author_Institution
    CREST, Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST) & JST, Tsukuba, Japan
  • fYear
    2011
  • fDate
    11-13 May 2011
  • Firstpage
    227
  • Lastpage
    230
  • Abstract
    We developed prototypes of miniaturized wireless sensor nodes for monitoring the power consumption of electrical devices and have been experimentally applying the networked monitoring system using them to power monitoring of the “convenience stores”. Nowadays, carbon dioxide (CO2) emission in the ICT field is increasing enormously due to the high electric power consumption of ICT devices, e.g., in internet data centers as well as offices and homes. In order to reduce ICT´s CO2 emission, it is indispensable to introduce energy management systems (EMS) taking the advantages of wireless sensor network technology. Therefore, we have been developing wireless clamp-meter probes integrated with a thermosensor and a monitoring system that enables simultaneous power consumption measurement of 50 power lines. Using the sensor nodes, power consumption monitoring of “convenience stores” was demonstrated and it was found that the obtained power “profile” of equipments can effectively present the key features of their-usage.
  • Keywords
    Internet; carbon compounds; computer centres; energy management systems; power consumption; temperature sensors; wireless sensor networks; CO2; ICT devices; ICT field; Internet data centers; carbon dioxide emission; commercial power consumption monitoring; electrical devices; energy management systems; miniaturized wireless sensor nodes; networked monitoring system; thermosensor; wireless clamp-meter probes; wireless sensor network; Electricity; Monitoring; Power demand; Prototypes; Temperature sensors; Wireless communication; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2011 Symposium on
  • Conference_Location
    Aix-en-Provence
  • Print_ISBN
    978-1-61284-905-8
  • Type

    conf

  • Filename
    6107987