DocumentCode :
559590
Title :
Study of black silicon obtained by deep reactive ion etching - approach to achieving the hot spot of a thermoelectric energy harvester
Author :
Nguyen, K.N. ; Abi-Saab, D. ; Malak, M. ; Basset, P. ; Richalot, E. ; Pavy, N. ; Flourens, F. ; Marty, F. ; Angelescu, D. ; Leprince-Wang, Y. ; Bourouina, T.
Author_Institution :
ESIEE Paris, Univ. Paris-Est, Noisy-le-Grand, France
fYear :
2011
fDate :
11-13 May 2011
Firstpage :
81
Lastpage :
84
Abstract :
In this paper we study the enhanced absorption properties of micro/nano structured silicon surface under incident electromagnetic (EM) illumination and then its capacity to convert light to heat. We then simulate the optical reflectance of the 3D micro/nano silicon cones of different dimensions. Equipped with the favorable simulation results we fabricate black silicon with excellent anti-reflectivity by using deep reactive ion etching (DRIE) under cryogenic temperatures. Reflectance measurement with an integrating sphere is approximately 1% in the optical wavelength range. Following this, black silicon with integrated resistance temperature detector (RTD) is developed to investigate its efficiency of the photo-thermal conversion.
Keywords :
elemental semiconductors; energy harvesting; micromechanical devices; nanostructured materials; photothermal conversion; silicon; sputter etching; thermoelectric devices; 3D micro/nano silicon cones; Si; absorption properties; black silicon; cryogenic temperatures; deep reactive ion etching; incident electromagnetic illumination; integrated resistance temperature detector; microstructured silicon surface; nanostructured silicon surface; optical reflectance; photo-thermal conversion; reflectance measurement; thermoelectric energy harvester; Cryogenics; Etching; Optical reflection; Optical surface waves; Reflectivity; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2011 Symposium on
Conference_Location :
Aix-en-Provence
Print_ISBN :
978-1-61284-905-8
Type :
conf
Filename :
6107999
Link To Document :
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