DocumentCode
559595
Title
Trends and challenges in modern MEMS sensor packages
Author
Marek, Jiri
Author_Institution
Robert Bosch GmbH, Reutlingen, Germany
fYear
2011
fDate
11-13 May 2011
Firstpage
1
Lastpage
3
Abstract
Modern MEMS sensors for automotive as well as consumer electronics face a continuous pressure for size reduction. This can be met not only by a consistent shrink of sensing elements and ASICs resulting in a smaller package but also through the integration of several sensors into one system. The trends and challenges of this steady shrink will be explained and several examples of current automotive and consumer MEMS sensors will be shown.
Keywords
application specific integrated circuits; automotive electronics; electric sensing devices; electronics packaging; micromechanical devices; ASIC; MEMS sensor packages; automotive sensors; consumer electronics; Automotive engineering; Lead;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2011 Symposium on
Conference_Location
Aix-en-Provence
Print_ISBN
978-1-61284-905-8
Type
conf
Filename
6108006
Link To Document