DocumentCode
559625
Title
Agile MEMS packaging for mass customized MEMS products
Author
Kaufmann, Jens G. ; Flynn, David ; Brown, Keith ; Desmulliez, Marc P Y
Author_Institution
Sch. of Eng. & Phys. Sci., Heriot-Watt Univ., Edinburgh, UK
fYear
2011
fDate
11-13 May 2011
Firstpage
41
Lastpage
45
Abstract
The market for micro electromechanical systems (MEMS) is becoming increasingly competitive especially for small and medium sized enterprises. The progressing trend in mass manufacturing leads to very few competitors that dominate the MEMS market. This competitive environment results in cheap devices with limited variation, therefore opportunities at the tail end of the market are usually neglected. The MEMS research community predominantly focuses on new device types and manufacturing methods with a high impact factor and those are naturally settled in the mass market segments. This paper introduces an approach for research and development that aims to open the opportunities within the long tail of the market. It consists mostly of a combination of new design approaches for MEMS and packaging, software tools and digital manufacturing technologies to ensure that solutions developed are ones that can be adapted to different customer requirement on a level that is perhaps uncommon in the MEMS community.
Keywords
mass production; micromechanical devices; packaging; product customisation; agile MEMS packaging; digital manufacturing; mass customized MEMS products; mass manufacturing; micro electromechanical systems; small and medium sized enterprises; software tools; Aircraft; Aircraft manufacture; Atmospheric modeling; Micromechanical devices; Three dimensional displays; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2011 Symposium on
Conference_Location
Aix-en-Provence
Print_ISBN
978-1-61284-905-8
Type
conf
Filename
6108037
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