• DocumentCode
    56047
  • Title

    Computational screening of new high voltage insulation gases with low global warming potential

  • Author

    Rabie, Mohamed ; Franck, Christian M.

  • Author_Institution
    Power Syst. & High Voltage Labs., ETH Zurich, Zurich, Switzerland
  • Volume
    22
  • Issue
    1
  • fYear
    2015
  • fDate
    Feb. 2015
  • Firstpage
    296
  • Lastpage
    302
  • Abstract
    We systematically screen chemical compounds for their suitability as high voltage insulation gases on the basis of electrical, environmental and safety characteristics. Recently, 1234 compounds were identified out of a library of over 56000 chemicals by means of virtual screening. The authors applied filters for the global warming potential (GWP), toxicity, stability, flammability and critical temperature to find promising candidate refrigerant fluids. We estimate the electric strength (ES) and the boiling point of these environmentally friendly compounds to select promising SF6 replacement candidates. The most promising candidates within our method are predominantly Fluoro-alkenes, -alkylsulfides, -alcohols and-alkylamines. In addition, risk and safety data was compiled for compounds that are supplied by chemical vendors at this date, resulting in 7 preliminary candidates.
  • Keywords
    SF6 insulation; boiling point; flammability; global warming; organic compounds; refrigerants; stability; toxicology; ES estimation; GWP; SF6 replacement candidate; boiling point; computational screening; electric strength estimation; electrical characteristics; environmental characteristics; flammability; fluoro-alcohol; fluoro-alkenes; fluoro-alkylamines; fluoro-alkylsulfides; high voltage insulation gas; low global warming potential; refrigerant fluid; safety characteristics; stability; systematically screen chemical compound; toxicity; Compounds; Erbium; Filtering; Gases; Global warming; Sulfur hexafluoride; Dielectric breakdown; SF6; gas insulation;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2014.004474
  • Filename
    7033399