Title :
Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications
Author :
Ng, Jack Hoyd-Gigg ; Ssekitoleko, Robert T. ; Flynn, David ; Kay, Robert W. ; Demore, Christine ; Cochran, Sandy ; Desmulliez, Marc P Y
Author_Institution :
Microsyst. Eng. Centre (MISEC), Heriot-Watt Univ., Edinburgh, UK
Abstract :
This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.
Keywords :
biomedical electronics; biomedical ultrasonics; bonding processes; detector circuits; flexible electronics; interconnections; microsensors; packaging; photolithography; ultrasonic transducer arrays; high frequency ultrasound device; innovative manufacturing; linear transducer array interconnection; low temperature conductive bonding; medical application; micro ultrasonic transducer; photolithography; precision dicing; rolled up flexible circuit; three dimensional packaging method; Biomedical imaging; Bonding; Catheters; Image resolution; Lifting equipment; Needles; 3D packaging; Linear array transducer; high frequency ultrasound;
Conference_Titel :
Microelectronics and Packaging Conference (EMPC), 2011 18th European
Conference_Location :
Brighton
Print_ISBN :
978-1-4673-0694-2
