• DocumentCode
    560999
  • Title

    The influence of copper trace routing on the BGA lifetime prediction in JEDEC drop tests

  • Author

    Kraemer, Frank ; Wiese, Steffen

  • Author_Institution
    Saarland Univ., Saarbrucken, Germany
  • fYear
    2011
  • fDate
    12-15 Sept. 2011
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Virtual prototyping is able to speed-up the development cycle of new products if based on exact models. In case of dynamic mechanical loads like JEDEC drop tests of BGA modules, broken copper traces at the PCB side are more and more often observed to be the ultimate failure effects. Straightforward FEM simulations showed unrealistic high stress and strain results not matching with the experimentally gained characteristic lifetimes of productive BGA components.
  • Keywords
    ball grid arrays; copper; failure analysis; finite element analysis; impact testing; life testing; printed circuit testing; virtual prototyping; BGA lifetime prediction; Cu; FEM simulation; JEDEC drop tests; PCB; copper trace routing; failure effect; virtual prototyping; Deformable models; Strain; FEM Simulations; JEDEC Drop Tests; Lifetime Prediction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Packaging Conference (EMPC), 2011 18th European
  • Conference_Location
    Brighton
  • Print_ISBN
    978-1-4673-0694-2
  • Type

    conf

  • Filename
    6142376
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=560999