The influence of copper trace routing on the BGA lifetime prediction in JEDEC drop tests

Virtual prototyping is able to speed-up the development cycle of new products if based on exact models. In case of dynamic mechanical loads like JEDEC drop tests of BGA modules, broken copper traces at the PCB side are more and more often observed to be the ultimate failure effects. Straightforward FEM simulations showed unrealistic high stress and strain results not matching with the experimentally gained characteristic lifetimes of productive BGA components.