Thermo-mechanical fatigue life evaluation for Sn-Pb and Sn-Ag solders

Author

Hiyoshi, Noritake ; Itoh, Takamoto ; Sakane, Masao

Author_Institution

Dept. of Mech. Eng., Ishikawa Nat. Coll. of Technol., Tsubata, Japan

fYear

2011

fDate

12-15 Sept. 2011

Firstpage

1

Lastpage

7

Abstract

This paper describes a new thermo-mechanical fatigue (TMF) machine developed for solders and discusses TMF characteristics of lead and lead-free solders. Isothermal low cycle fatigue (LCF) tests were performed using Sn-37Pb, Sn-3.5Ag and Sn-3.0Ag-0.5Cu solders at 253K and 353K and in-phase and out-of-phase TMF tests using the same solders at the temperature range of 253K-353K. There was no large difference in fatigue life between LCF and TMF tests for Sn-37Pb solder but there exited clear difference depending on temperature and phase shift for Sn-3.5Ag and Sn-3.0Ag-0.5Cu solders. This study proposed an energy based method for estimating the TMF lives of Sn-3.5Ag and Sn-3.0Ag-0.5Cu solders.

Keywords

copper alloys; fatigue; fatigue testing; lead alloys; silver alloys; solders; thermal stress cracking; thermomechanical treatment; tin alloys; SnAg; SnAgCu; SnPb; energy based method; isothermal low cycle fatigue testing; lead-free solders; phase shift; temperature 253 K to 353 K; temperature shift; thermomechanical fatigue life evaluation; Bismuth; Copper; Iron; Lead; Resistance heating; Tin; Fatigue life estimation; Solder; Temperature; Thermo-mechanical fatigue;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics and Packaging Conference (EMPC), 2011 18th European

Conference_Location

Brighton

Print_ISBN

978-1-4673-0694-2

Type

conf

Filename

6142401