Development and characterization of 300mm large panel eWLB (embedded wafer level BGA)

Author

Seung Wook Yoon ; Lin, Yaojian ; Marimuthu, Pandi C.

Author_Institution

STATS ChipPAC Ltd., Singapore, Singapore

fYear

2011

fDate

12-15 Sept. 2011

Firstpage

1

Lastpage

5

Abstract

This paper will highlight some of the recent advancements in 300mm eWLB large panel development. Compared to 200mm case, 300mm large panel has more warpage and process issues due to its area increase. Thermo-mechanical simulation shows 100~150% more warpage with 300mm large panel compared to 200mm. So various design parameters were studied to optimized warpage, such as dielectric materials and thickness, molding compound thickness etc. This paper also presents study of process optimization for 300mm eWLB and on overall warpage behavior in different process steps. Finally 300mm eWLB test vehicles are fabricated and tested in JEDEC standard test conditions. It also describes mechanical characterization, reliability data including component/board level, challenges encountered and overcome, and future steps.

Keywords

ball grid arrays; integrated circuit manufacture; integrated circuit reliability; integrated circuit testing; wafer level packaging; JEDEC standard test; ball grid arrays; dielectric materials; embedded wafer level BGA; size 200 mm; size 300 mm; thermo-mechanical simulation; warpage behavior; Electromagnetic compatibility; Materials; Semiconductor device modeling; US Department of Energy; 300mm large scale; Fanout WLP; embedded wafer level packaging (eWLB); process development; process optimization; reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics and Packaging Conference (EMPC), 2011 18th European

Conference_Location

Brighton

Print_ISBN

978-1-4673-0694-2

Type

conf

Filename

6142403