• DocumentCode
    561025
  • Title

    Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application

  • Author

    Otiaba, K.C. ; Ekere, N.N. ; Bhatti, R.S. ; Mallik, S. ; Amalu, E.H.

  • Author_Institution
    Electron. Manuf. Eng. Res. Group, Univ. of Greenwich, Chatham, UK
  • fYear
    2011
  • fDate
    12-15 Sept. 2011
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    The under-hood automotive ambient is harsh and its impact on electronics used in electronic control unit (ECU) assembly is a concern. The introduction of Euro 6 standard (Latest European Union Legislation) leading to increase in power density of power electronics in ECU has even amplified the device thermal challenge. Heat generated within the unit coupled with ambient temperature makes the system reliability susceptible to thermal degradation which may result in catastrophic failure if not efficiently dissipated. Previous investigations show that the technology of thermal interface materials (TIMs) is a key to achieving good heat conductions within a package and from a package to heat sinking device. With studies suggesting that conventional TIMs contribute about 60% interfacial thermal resistance, innovative technology is required to improve the thermal performance of TIMs. A review of emerging nanotechnology in TIMs shows that carbon nanotubes (CNTs) and carbon nanofibres (CNFs) when used as the structure of TIM or TIM filler could improve the overall thermal and mechanical properties of TIMs. Hence, CNTs/CNFs have the potentials to advance thermal management issues in ECU. This search identifies chemical vapour deposition (CVD) as a low cost process for the commercial production of CNTs. In addition, this review further highlights the capability of CVD to grow nanotubes directly on a desired substrate. Other low temperature techniques of growing CNT on sensitive substrates are also presented in this paper.
  • Keywords
    assembling; automotive electronics; carbon nanotubes; chemical vapour deposition; heat sinks; nanoelectronics; thermal management (packaging); thermal resistance; Euro 6 standard; Latest European Union Legislation; TIM filler; ambient temperature; automotive electronic control unit application; carbon nanofibres; carbon nanotubes; catastrophic failure; chemical vapour deposition; device thermal challenge; electronic control unit assembly; heat conductions; heat sinking device; interfacial thermal resistance; low temperature techniques; mechanical properties; nanotechnology-based thermal interface materials; power density; power electronics; system reliability; thermal degradation; thermal management issues; thermal performance; thermal properties; under-hood automotive ambient; Heating; Lead; Mechanical factors; Springs; Substrates; Thermal conductivity; Thermal resistance; Carbon nanotubes; Electronic Control Unit; Thermal Interface Materials; Thermal Management; Thermal Resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Packaging Conference (EMPC), 2011 18th European
  • Conference_Location
    Brighton
  • Print_ISBN
    978-1-4673-0694-2
  • Type

    conf

  • Filename
    6142405