Low-pressure sintering of silver micro- and nanoparticles for a high temperature stable pick & place die attach

Author

Kähler, J. ; Heuck, N. ; Palm, G. ; Stranz, A. ; Waag, A. ; Peiner, E.

Author_Institution

Inst. of Semicond. Technol., Tech. Univ. Braunschweig, Braunschweig, Germany

fYear

2011

fDate

12-15 Sept. 2011

Firstpage

1

Lastpage

7

Abstract

Die attach using a pick & place process based on pressure-assisted Ag sintering was described for the assembly of hybrid circuits designed for operation up to 250 °C and above. Silver pastes with different ratios of nano- and micro-particles were analyzed regarding porosity, Young`s modulus, adhesion, electrical, and thermal conductivity in dependence of the sintered layer thickness. Temperature load capability was demonstrated by shear tests of bonded devices after temperature cycling between 30°C and 250°C. Commercial flip-chip devices were successfully bonded on substrates using pressure-assisted silver sintering for the first time.

Keywords

Young´s modulus; adhesion; flip-chip devices; high-temperature electronics; hybrid integrated circuits; microassembling; nanoparticles; silver; sintering; Ag; Young´s modulus; adhesion; electrical conductivity; flip-chip devices; high temperature stable pick & place die attach; hybrid circuits assembly; low-pressure sintering; microparticles; nanoparticles; pressure-assisted sintering; temperature 30 C to 250 C; thermal conductivity; Annealing; Assembly; Powders; Electronics packaging; flip-chip; nanoparticles; semiconductor device packaging; silver sintering;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics and Packaging Conference (EMPC), 2011 18th European

Conference_Location

Brighton

Print_ISBN

978-1-4673-0694-2

Type

conf

Filename

6142408