Title :
Copper makes a lot of cents
Author :
Flowers, Chris ; Owen, Martyn
Author_Institution :
CSR, Cambridge, UK
Abstract :
Transitioning from gold to copper wirebonding can provide significant cost saving for the semiconductor industry. However the move to copper wirebonding is not without risk and this paper will address the measures of end product quality that are essential for reliable products in the commercial sector.
Keywords :
copper; gold; lead bonding; Au; Cu; IMC; bHAST; semiconductor industry; wirebonding; Assembly; Moisture measurement; Reliability; Copper; IMC; bHAST; reliability; wirebond;
Conference_Titel :
Microelectronics and Packaging Conference (EMPC), 2011 18th European
Conference_Location :
Brighton
Print_ISBN :
978-1-4673-0694-2
