DocumentCode
561046
Title
Development of an intelligent integrated LED system-in-package
Author
Gielen, A.W.J. ; Hesen, P. ; Swartjes, F. ; van Zeijl, H. ; Boschman, F. ; Bullema, J-E ; Werkhoven, R.J. ; Koh, S.
Author_Institution
TNO, Eindhoven, Netherlands
fYear
2011
fDate
12-15 Sept. 2011
Firstpage
1
Lastpage
7
Abstract
Intelligent LED lighting systems can save up to 80% of energy compared to traditional lighting systems. In order to provide these intelligent lighting products at reaseonable costs, integration and miniaturisation are important steps. To this end we have designed a LED system-in-package that combines LEDs, driver ICs, and passives into a single package. In future we will expand this package with other functions, for example presence detection technology and wireless communication. Due to the heat dissipation in the LEDs and driver ICs, the thermal load in the package is considerable, challenging the reliability of the system-in-package. Furthermore, to be economically viable, the lifetime of the LED SiP is much longer than traditional electronics. The design lifetime of LED luminaires is typically 25 to 50 thousand hours. An initial assessment of the thermal performance of our LED SiP shows that the thermal management is challenging the reliability limits, and we expect that with optimization the thermal loads can be accommodated at reaseonable levels. Also our first failure calculations indicate that our required lifetime is feasible. Finally, the fabrication of our SiP is based on readily available manufacturing techniques. Future work will focus on further optimizing our design.
Keywords
driver circuits; light emitting diodes; optimisation; system-in-package; thermal management (packaging); LED luminaires; LED system-in-package; driver integrated circuit; intelligent LED lighting systems; intelligent integrated LED; optimization; reliability; single package; thermal load; thermal management; wireless communication; Compounds; Electronic packaging thermal management; Heating; Light emitting diodes; Lighting; Materials; Thermal loading; LED; energy saving; integrated system; system-in-package;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics and Packaging Conference (EMPC), 2011 18th European
Conference_Location
Brighton
Print_ISBN
978-1-4673-0694-2
Type
conf
Filename
6142428
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