Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils

The aim of the research described in this paper is to develop a low-cost, roll-to-roll compatible process for the realization of electronic systems in foil using chip embedding. The small cost makes these systems suitable for disposable applications as food labels, medicine packages or smart bandages. Surface mount attaching of components on foils is a well-known process for building systems-in-foil. When using low-cost films like PEN and PET, there are serious restrictions on the maximum temperatures that can be used for the surface mounting process (soldering, adhesive bonding). Surface mounting has the additional disadvantage that the components are on the surface of the foil and are therefore not well protected mechanically and physically. The proposed process flow for embedding thin chips in PET foils overcomes these limitations. A key aspect of this technology is the application of a suitable adhesive to encapsulate the chips. The resulting product is based on full-metal copper which has a good thermal and electrical conductivity and allows for fine pitches. The process is compatible with several metal foils (Cu, Al ...), offering further possibilities in cost reduction, and does not rely on bumping of the chips or plating of the interconnections to the chips.