DocumentCode :
56266
Title :
Foundation of mathematical deterioration models for the thermal stress
Author :
Hirose, Hideo ; Sakumura, Takenori
Author_Institution :
Kyushu Inst. of Technol., Fukuoka, Japan
Volume :
22
Issue :
1
fYear :
2015
fDate :
Feb. 2015
Firstpage :
482
Lastpage :
487
Abstract :
We construct mathematical models to represent the relationship between the thermal stress and the deterioration rate for electrical insulation. The Arrhenius-log-normal model has been used generally for such a deterioration model due to the thermal stress. The Arrhenius law is based on the chemical reaction theory between the absolute temperature and the activity of materials. On the other hand, as for the log-normal distribution, we have been only followed the traditional statistical treatment such that the deterioration could be represented by the normal distribution when logarithmic time is used. The Arrhenius-log-normal model is a combination of these two models. However, in the International Electrotechnical Commission 60216-1, deterioration due to the thermal stress is represented by the mechanical strength, and the time showing 50% mechanical strength to the initial strength is defined as the failure time. We assume here the generalized Pareto distribution model, the generalized logistic distribution model, or the normal distribution model for such a model. Thus, in this paper, we construct new mathematical models combined by the Arrhenius law with the generalized Pareto distribution model, the generalized logistic distribution model, or the normal distribution model.
Keywords :
Pareto analysis; Pareto distribution; insulation; log normal distribution; mathematical analysis; mechanical strength; thermal stresses; Arrhenius-log-normal distribution model; International Electrotechnical Commission 60216-1; Mathematical Deterioration Models; Thermal Stress; absolute temperature; chemical reaction theory; electrical insulation; generalized Pareto distribution model; generalized logistic distribution model; logarithmic time; mechanical strength; statistical treatment; Aging; Insulation; Logistics; Materials; Mathematical model; Stress; Thermal stresses; Arrhenius law; Thermal deterioration; generalized Pareto distribution; generalized logistic distribution; growth curve; log-normal distribution; maximum likelihood estimation method; method of least squares; ordinary differential equation;
fLanguage :
English
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9878
Type :
jour
DOI :
10.1109/TDEI.2014.004450
Filename :
7033419
Link To Document :
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