• DocumentCode
    563494
  • Title

    Transfer efficiency of e-beam fabricated C4D´S

  • Author

    Krambeck, R.H. ; Retajczyk, T.F., Jr. ; Yau, L.D.

  • Author_Institution
    Bell Labs., Murray Hill, NJ, USA
  • fYear
    1974
  • fDate
    9-11 Dec. 1974
  • Firstpage
    248
  • Lastpage
    250
  • Abstract
    In this work a quantitative analysis of the low frequency loss mechanisms of the Conductively Connected CCD will be presented. It will be shown that the loss is caused by changes in the shape and height of the implanted potential carrier. The loss is approximately inversely proportional to feature size and directly proportional to oxide thickness. Experimental data on electron beam fabricated devices will be given that shows good agreement with the theoretical calculations. It will be shown that for a 500 Å oxide, usable devices were made with areas as small as 125 μ2 (.2mil2) per bit.
  • Keywords
    charge-coupled devices; C4D fabrication; conductively connected CCD; e-beam; electron beam fabricated devices; implanted potential carrier; low frequency loss mechanisms; oxide thickness; quantitative analysis; transfer efficiency; Abstracts; Capacitance; Fabrication; Frequency modulation; Shape; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 1974 International
  • Conference_Location
    Washington, DC
  • ISSN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.1974.6219757
  • Filename
    6219757