DocumentCode
563494
Title
Transfer efficiency of e-beam fabricated C4D´S
Author
Krambeck, R.H. ; Retajczyk, T.F., Jr. ; Yau, L.D.
Author_Institution
Bell Labs., Murray Hill, NJ, USA
fYear
1974
fDate
9-11 Dec. 1974
Firstpage
248
Lastpage
250
Abstract
In this work a quantitative analysis of the low frequency loss mechanisms of the Conductively Connected CCD will be presented. It will be shown that the loss is caused by changes in the shape and height of the implanted potential carrier. The loss is approximately inversely proportional to feature size and directly proportional to oxide thickness. Experimental data on electron beam fabricated devices will be given that shows good agreement with the theoretical calculations. It will be shown that for a 500 Å oxide, usable devices were made with areas as small as 125 μ2 (.2mil2) per bit.
Keywords
charge-coupled devices; C4D fabrication; conductively connected CCD; e-beam; electron beam fabricated devices; implanted potential carrier; low frequency loss mechanisms; oxide thickness; quantitative analysis; transfer efficiency; Abstracts; Capacitance; Fabrication; Frequency modulation; Shape; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 1974 International
Conference_Location
Washington, DC
ISSN
0163-1918
Type
conf
DOI
10.1109/IEDM.1974.6219757
Filename
6219757
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