Title :
Technology migration and thermal coupling
Author :
Janicki, Marcin ; Zajac, Piotr ; Szermer, Michal ; Napieralski, Andrzej
Author_Institution :
Dept. of Microelectron. & Comput. Sci., Tech. Univ. of Lodz, Lodz, Poland
Abstract :
This paper presents the problem of ever increasing thermal coupling between integrated circuit components induced by the technology migration to newer technology nodes. All the discussions here are based on the results of static and dynamic thermal simulations of a test ASIC which contains a large matrix of heat sources.
Keywords :
application specific integrated circuits; integrated circuit testing; ASIC testing; dynamic thermal simulations; heat sources; integrated circuit components; static thermal simulations; technology migration; thermal coupling; Application specific integrated circuits; Computer architecture; Couplings; Heating; Integrated circuit modeling; Solid modeling; Thermal analysis; Many-core architectures; technology migration; thermal coupling;
Conference_Titel :
Mixed Design of Integrated Circuits and Systems (MIXDES), 2012 Proceedings of the 19th International Conference
Conference_Location :
Warsaw
Print_ISBN :
978-1-4577-2092-5
