DocumentCode
564143
Title
Device-circuit models for extreme environment space electronics
Author
Turowski, Marek ; Raman, Ashok
Author_Institution
CFD Res. Corp. (CFDRC), Huntsville, AL, USA
fYear
2012
fDate
24-26 May 2012
Firstpage
350
Lastpage
355
Abstract
To design wide-temperature radiation-tolerant electronic systems for space missions and predict their characteristics and reliability in space, advanced models and simulation tools are required at multiple levels. Detailed, physics-based three-dimensional (3D) technology computer-aided-design (TCAD) device models, coupled in mixed-mode with external circuit models, enable accurate simulation and prediction of space electronics performance in extreme environments. We show the importance of correct device physics models for accurate computation of both steady-state and transient characteristics. Mixed-mode coupling of a realistic load circuit with the 3D TCAD device model is critical to be able to compute single-event transient waveforms and circuit characteristics that reflect well experimental results.
Keywords
aerospace instrumentation; avionics; integrated circuit design; integrated circuit modelling; integrated circuit reliability; mixed analogue-digital integrated circuits; space research; technology CAD (electronics); 3D TCAD device model; device-circuit models; extreme environment space electronics; load circuit; mixed-mode coupling; physics-based three-dimensional technology computer-aided-design; reliability; single-event transient waveforms; space missions; wide-temperature radiation-tolerant electronic systems; Analytical models; Computational modeling; Equations; Integrated circuit modeling; Mathematical model; Numerical models; Solid modeling; 3D; Radiation effects; TCAD; extreme low temperature models; mixed-mode simulation; single-event effects (SEE);
fLanguage
English
Publisher
ieee
Conference_Titel
Mixed Design of Integrated Circuits and Systems (MIXDES), 2012 Proceedings of the 19th International Conference
Conference_Location
Warsaw
Print_ISBN
978-1-4577-2092-5
Type
conf
Filename
6226219
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