• DocumentCode
    564146
  • Title

    Joint simulation of mixed-signal integrated circuits and printed circuit boards

  • Author

    Cederström, Love ; Graupner, Achim

  • Author_Institution
    Zentrum Mikroelektron. Dresden AG, Dresden, Germany
  • fYear
    2012
  • fDate
    24-26 May 2012
  • Firstpage
    364
  • Lastpage
    369
  • Abstract
    As system complexities and the market share of mixed signal products increase, design and test of integrated circuits (ICs) will become more difficult. This indicates that design of printed circuit boards (PCBs) for test must be integrated into the IC development flows. We propose software supported model translation to enable a method of joint simulation of a PCB and an IC in an integrated environment. The method employed can be shown to increase model coverage to more than 90 % for analog time domain models from some of the largest component suppliers. The benefits of this are demonstrated through analog simulations that reuse existing testbenches for an IC, uncovering potentially unstable transient effects arising from the combination of the IC and PCB.
  • Keywords
    circuit simulation; integrated circuit design; integrated circuit testing; mixed analogue-digital integrated circuits; printed circuit design; printed circuit testing; time-domain analysis; PCB simulation; analog time domain model; integrated circuit design; integrated circuit testing; mixed-signal IC simulation; mixed-signal integrated circuit simulation; printed circuit board simulation; software supported model translation; Integrated circuit modeling; Libraries; SPICE; Semiconductor device modeling; Semiconductor process modeling; circuit boards; circuit simulation; circuit testing; design methodology; joint simulation; mixed analog digital integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mixed Design of Integrated Circuits and Systems (MIXDES), 2012 Proceedings of the 19th International Conference
  • Conference_Location
    Warsaw
  • Print_ISBN
    978-1-4577-2092-5
  • Type

    conf

  • Filename
    6226222