Title :
Design model and data management for 3D integration technologies
Author :
Grünewald, Armin ; Hahn, Kai ; Brück, Rainer
Author_Institution :
Inst. of Microsyst. Eng., Univ. of Siegen, Siegen, Germany
Abstract :
Developing 3D systems is a highly complex procedure. Next to a huge variation of possibilities on how to vertically integrate two or more dies, a lot of aspects regarding cost, design and application specific selection of technology have to be considered. Therefore a design model, considering the mutual influence of design and process technology during the integration flow development and a data management to create and store process flows, is necessary.
Keywords :
integrated circuit design; integrated circuit modelling; three-dimensional integrated circuits; 3D integration technology; TSV; data management; design model; integration flow development; process flow technology; Copper; Databases; Materials; Semiconductor device modeling; Solid modeling; Through-silicon vias; 3D integration; TSV; data management; design model; die stack; process flow;
Conference_Titel :
Mixed Design of Integrated Circuits and Systems (MIXDES), 2012 Proceedings of the 19th International Conference
Conference_Location :
Warsaw
Print_ISBN :
978-1-4577-2092-5
