Abstract :
The research related to micro- and nanoelectronics can be grouped in three main directions, i.e., More Moore, Beyond CMOS and More than Moore. For each of them some general trends and challenges are addressed. The convergence of the top-down technology, with bottom-up methods derived from fundamental disciplines such as materials physics, chemistry and biotechnology is opening a totally new world of applications. The diversity of the `More than Moore´ domain, includes applications related to ambient intelligence, automotives, molecular electronics, nano-biotechnology, polymer electronics, sustainable energy based on photovoltaic cells and human healthcare.
Keywords :
CMOS integrated circuits; integrated circuit packaging; integrated circuit technology; nanoelectronics; CMOS technology; MEMS devices; ambient intelligence; automotives; bottom-up methods; human healthcare; material physics; microelectronics; molecular electronics; more than Moore domain; nanobiotechnology; nanoelectronics; photovoltaic cells; polymer electronics; sustainable energy; top-down technology; CMOS integrated circuits; Logic gates; Packaging; Performance evaluation; Silicon; Transistors; Moore´s law; Scaling; Strain engineering; automotives; healthcare; heterogeneous integration; packaging;
