Title :
An LTCC laminated combing filter with layer interconnection structure
Author :
Zhang, Tiedi ; Zhan, Mingzhou ; Xu, Ruimin ; Yao, Yao
Author_Institution :
Fundamental Sci. on EHF Lab., Univ. of Electron. Sci. & Technol. of China (UESTC), Chengdu, China
Abstract :
This paper presents design and realization of a laminated stripline band-pass filter. With the process of Low-temperature co-fired ceramics (LTCC), a Chebyshev bandpass filter with ten-layer dielectric substrate is fabricated. In order to miniaturize the dimension, the five-layer combing line form is under discussion and applied. To make the measurement easier and practical application available, a layer interconnection structure is designed and connected to the filter. EM simulation is employed to estimate the performance of the filter and do optimization. Simulation result and measuring model show that the effective dimension of the filter is 10 mm×2.9 mm×0.94 mm while it works at center frequency 1.1 GHz. The result of S-parameter indicates that the insert loss in band is less than 1.7 dB and return loss is better than 13 dB.
Keywords :
Chebyshev filters; S-parameters; band-pass filters; ceramics; firing (materials); integrated circuit interconnections; microwave filters; optimisation; Chebyshev bandpass filter; LTCC laminated combing filter; S-parameter; laminated stripline band-pass filter; layer interconnection structure; low-temperature co-fired ceramics; optimization; ten-layer dielectric substrate; Band pass filters; Ceramics; Couplings; Insertion loss; Microwave filters; Stripline; Temperature measurement;
Conference_Titel :
Microwave and Millimeter Wave Technology (ICMMT), 2012 International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4673-2184-6
DOI :
10.1109/ICMMT.2012.6230329