DocumentCode
564335
Title
An LTCC laminated combing filter with layer interconnection structure
Author
Zhang, Tiedi ; Zhan, Mingzhou ; Xu, Ruimin ; Yao, Yao
Author_Institution
Fundamental Sci. on EHF Lab., Univ. of Electron. Sci. & Technol. of China (UESTC), Chengdu, China
Volume
4
fYear
2012
fDate
5-8 May 2012
Firstpage
1
Lastpage
3
Abstract
This paper presents design and realization of a laminated stripline band-pass filter. With the process of Low-temperature co-fired ceramics (LTCC), a Chebyshev bandpass filter with ten-layer dielectric substrate is fabricated. In order to miniaturize the dimension, the five-layer combing line form is under discussion and applied. To make the measurement easier and practical application available, a layer interconnection structure is designed and connected to the filter. EM simulation is employed to estimate the performance of the filter and do optimization. Simulation result and measuring model show that the effective dimension of the filter is 10 mm×2.9 mm×0.94 mm while it works at center frequency 1.1 GHz. The result of S-parameter indicates that the insert loss in band is less than 1.7 dB and return loss is better than 13 dB.
Keywords
Chebyshev filters; S-parameters; band-pass filters; ceramics; firing (materials); integrated circuit interconnections; microwave filters; optimisation; Chebyshev bandpass filter; LTCC laminated combing filter; S-parameter; laminated stripline band-pass filter; layer interconnection structure; low-temperature co-fired ceramics; optimization; ten-layer dielectric substrate; Band pass filters; Ceramics; Couplings; Insertion loss; Microwave filters; Stripline; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave and Millimeter Wave Technology (ICMMT), 2012 International Conference on
Conference_Location
Shenzhen
Print_ISBN
978-1-4673-2184-6
Type
conf
DOI
10.1109/ICMMT.2012.6230329
Filename
6230329
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