Title :
Synchronized oscillation in micro-mechanically coupled oscillator system: Part I - Synchronization bandwidth
Author :
Nakajima, Masahiro ; Wang, Dong ; Ikehara, T. ; Itoh, Takayuki ; Maeda, Ryutaro
Author_Institution :
Dept. of Mech. Eng., Ibaraki Univ., Hitachi, Japan
Abstract :
A novel oscillation system, consisting of a U-shaped cantilever and a beam-shaped cantilever, was designed, fabricated and characterized for synchronized oscillation-based ultimate sensing applications in our past studies. This paper reports that the effect of nonlinear vibration on double region of synchronized frequency responses so as to further expand the applicable limits for practical mass perturbation. The resonant frequency was multiplied via synchronization by introducing two coupling overhangs, and the double region was expanded from 70 Hz to over 500 Hz by increasing the driving voltage (induced power). This expansion is believed to be related to nonlinear characteristic of coupled oscillator, and the relation between nonlinearity and synchronization should be clarified to achieve a design principle of mechanically coupled mass sensor for various ultimate sensing applications.
Keywords :
cantilevers; frequency response; micromechanical devices; oscillators; synchronisation; vibrations; U-shaped cantilever; beam-shaped cantilever; coupled oscillator nonlinear characteristics; coupling overhangs; design principle; driving voltage; mechanically coupled mass sensor; micromechanical coupled oscillator system; nonlinear vibration; practical mass perturbation; resonant frequency; synchronization bandwidth; synchronized frequency response; synchronized oscillation; synchronized oscillation-based ultimate sensing applications; ultimate sensing applications; Bandwidth; Frequency synchronization; Lasers; Measurement by laser beam; Oscillators; Resonant frequency; Silicon; Coupling overhang; Double region; Mechanically coupled U-shaped oscillator system; Nonlinearity; Synchronization bandwidth; Synchronized oscillation; Ultimate sensing;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
Conference_Location :
Cannes
Print_ISBN :
978-1-4673-0785-7