Title :
Asymmetric focusing microlens array fabricated by off-axis lithography
Author :
Hung, Chien-Hsin ; Chang, Po-Sen ; Yeh, Mao-Hsun ; Yang, Hsiharng
Author_Institution :
Grad. Inst. of Precision Eng., Nat. Chung Hsing Univ., Taichung, Taiwan
Abstract :
This research aims to make a microlens with a given inclined angle and applied to the light signal processing system. With two circular pattern masks with different diameters, a circular photoresist column structure is firstly made with the photolithography, whose first layer would be got after the small sized circular mask is taken for exposure and development. It is finalized through hard bake and then sputtered with a layer of metal (Cu), and then remained by taking the lift-off method. In the second part, the large sized circular mask is used. And the large sized circular pattern is shifted toward one direction to cover the first layer of metal pattern for the second exposure by taking the counterpoint exposure method to obtain the photoresist column structure. During the process of thermal reflow, there is no change in surface morphology of the first layer of metal pattern since it has been fixed. However, in the second layer of photoresist which goes through the deviation counterpoint exposure, the photoresist column is converted to rubbery state when its temperature is increased to the glass transition temperature (Tg) during the thermal reflow. Then the asymmetric microlens structure can be formed by shifting the arc vertex of microlens toward one direction with the fact that the copper coating surface is superior to silicon substrate surface in hydrophobicity. In this research, a 55° asymmetric microlens array can be manufactured by properly controlling the copper pattern size and the offset of two centers with the above method.
Keywords :
array signal processing; coatings; copper; glass transition; micro-optomechanical devices; microlenses; photolithography; photoresists; surface morphology; Cu; arc vertex; asymmetric focusing microlens array fabrication; asymmetric microlens array; asymmetric microlens structure; circular pattern masks; circular photoresist column structure; copper coating surface; copper pattern size; counterpoint exposure method; deviation counterpoint exposure; glass transition temperature; hydrophobicity; inclined angle; large sized circular pattern; lift-off method; light signal processing system; metal layer sputtering; off-axis lithography; photolithography; photoresist column; photoresist column structure; rubbery state; silicon substrate surface; small sized circular mask; surface morphology; thermal reflow; Arrays; Coatings; Copper; Lenses; Microoptics; Resists; Substrates;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
Conference_Location :
Cannes
Print_ISBN :
978-1-4673-0785-7